发明申请
- 专利标题： Thermal processing method and thermal processing unit
- 专利标题（中）： 热处理方法和热处理单元
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申请号： US10551033申请日： 2004-03-29
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公开(公告)号： US20070095288A1公开(公告)日： 2007-05-03
- 发明人: Takanori Saito , Kazuhide Serizawa , Takashi Ichikawa
- 申请人： Takanori Saito , Kazuhide Serizawa , Takashi Ichikawa
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-097672 20030401
- 国际申请： PCT/JP04/04454 WO 20040329
- 主分类号： B05D3/02
- IPC分类号： B05D3/02 ; C23C16/00
摘要：
The present invention is a thermal processing method including: a step of conducting a predetermined thermal process in a low temperature zone to a plurality of objects to be processed held in a tier-like manner by a heating unit, in a processing container that is made of metal and has the heating unit therein, and a step of introducing a cooling gas into respective areas in the processing container divided in a height direction of the objects to be processed.
公开/授权文献
- US07537448B2 Thermal processing method and thermal processing unit 公开/授权日：2009-05-26