发明申请
- 专利标题： ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING
- 专利标题（中）： 用于ECMP抛光垫调节的电化学方法
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申请号： US11554928申请日： 2006-10-31
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公开(公告)号： US20070095677A1公开(公告)日： 2007-05-03
- 发明人: You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
- 申请人： You Wang , Stan Tsai , Lakshmanan Karuppiah , Jie Diao , Renhe Jia , Alpay Yilmaz
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 主分类号： B23H3/00
- IPC分类号： B23H3/00
摘要：
A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
公开/授权文献
- US07504018B2 Electrochemical method for Ecmp polishing pad conditioning 公开/授权日：2009-03-17
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