发明申请
- 专利标题： Semiconductor apparatus testing arrangement and semiconductor apparatus testing method
- 专利标题（中）： 半导体装置测试装置和半导体装置测试方法
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申请号： US11339826申请日： 2006-01-26
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公开(公告)号： US20070096761A1公开(公告)日： 2007-05-03
- 发明人: Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
- 申请人： Shigeyuki Maruyama , Yoshikazu Arisaka , Kazuhiro Tashiro , Takayuki Katayama , Tetsu Ozawa , Yuushin Kimura
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2005-315995 20051031
- 主分类号： G01R31/26
- IPC分类号： G01R31/26
摘要：
A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
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