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    Testing device and testing method of a semiconductor device
    3.
    发明申请
    Testing device and testing method of a semiconductor device 有权

    公开(公告)号：US20060220667A1

    公开(公告)日：2006-10-05

    申请号：US11211094

    申请日：2005-08-25

    申请人： Kazuhiro Tashiro ,  Yasuyuki Itou ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka

    发明人： Kazuhiro Tashiro ,  Yasuyuki Itou ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887

    摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.

    Testing device and testing method of a semiconductor device
    6.
    发明授权
    Testing device and testing method of a semiconductor device 有权
    半导体器件的测试装置和测试方法

    公开(公告)号：US07129726B2

    公开(公告)日：2006-10-31

    申请号：US11211094

    申请日：2005-08-25

    申请人： Kazuhiro Tashiro ,  Yasuyuki Itou ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka

    发明人： Kazuhiro Tashiro ,  Yasuyuki Itou ,  Shigeyuki Maruyama ,  Yoshikazu Arisaka

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887

    摘要： A testing device can perform a test on an arbitrary one of a plurality of semiconductor devices by pressing the semiconductor devices onto a contactor from a back side of the semiconductor device. A test circuit board has a contactor provided with contact pieces corresponding to external connection terminals of semiconductor devices to be tested. A support board is capable of mounting the semiconductor devices thereon in an aligned state. A stage supports the support board. A press head presses the semiconductor devices to be tested mounted on the support board so as to cause external connection terminals of the semiconductor devices to be tested to contact with the contact pieces of the contactor. The stage is movable to a position at which at least one of the semiconductor devices to be tested, which are mounted on the support board, faces the contactor.

    摘要翻译： 测试装置可以通过将半导体器件从半导体器件的背面按压到接触器上来对多个半导体器件中的任意一个进行测试。 测试电路板具有接触器，该接触器具有与待测试的半导体器件的外部连接端子相对应的接触片。 支撑板能够以对准状态将半导体器件安装在其上。 舞台支持支持板。 压头按压待安装在支撑板上的待测试的半导体器件，以便使半导体器件的外部连接端子被测试以与接触器的接触片接触。 舞台可移动到安装在支撑板上的要测试的半导体器件中的至少一个面向接触器的位置。

    Tray in combination with electronic component attaching tool attached to the tray
    7.
    发明授权
    Tray in combination with electronic component attaching tool attached to the tray 失效
    托盘与附在托盘上的电子元件连接工具组合

    公开(公告)号：US08671557B2

    公开(公告)日：2014-03-18

    申请号：US13242647

    申请日：2011-09-23

    申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

    IPC分类号： B23P19/00

    CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

    摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

    摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。

    Semiconductor device packaging structure
    8.
    发明授权
    Semiconductor device packaging structure 有权
    半导体器件封装结构

    公开(公告)号：US08164181B2

    公开(公告)日：2012-04-24

    申请号：US12872131

    申请日：2010-08-31

    申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

    IPC分类号： H01L23/12

    CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

    摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

    Semiconductor testing device
    10.
    发明授权
    Semiconductor testing device 有权
    半导体测试装置

    公开(公告)号：US07161370B2

    公开(公告)日：2007-01-09

    申请号：US11046883

    申请日：2005-02-01

    申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

    发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

    IPC分类号： G01R31/26

    CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

    摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

    摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。