发明申请
- 专利标题: Method of manufacturing flexible laminate substrate
- 专利标题(中): 制造柔性层压基板的方法
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申请号: US10584352申请日: 2004-12-20
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公开(公告)号: US20070113972A1公开(公告)日: 2007-05-24
- 发明人: Takashi Kikuchi , Hiroyuki Tsuji
- 申请人: Takashi Kikuchi , Hiroyuki Tsuji
- 申请人地址: JP Osaka 530-8288
- 专利权人: KANEKA CORPORATION
- 当前专利权人: KANEKA CORPORATION
- 当前专利权人地址: JP Osaka 530-8288
- 优先权: JP2003-434215 20031226
- 国际申请: PCT/JP04/19491 WO 20041220
- 主分类号: B32B37/12
- IPC分类号: B32B37/12 ; B32B37/26 ; B29C65/02
摘要:
Disclosed is a method of manufacturing a flexible laminate substrate having an improved appearance and dimensional stability after removal of a metal foil. Specifically disclosed is a method of manufacturing a flexible laminate substrate 5 wherein a metal foil 2 is bonded to at least one surface of a heat-resistant adhesive film 3. The method comprises a step wherein the heat-resistant adhesive film 3 and the metal foil 2 are thermally laminated between a pair of metal rolls 4 via a protective film 1, thereby forming a laminate 7 wherein the heat-resistant adhesive film 3, the metal foil 2, and the protective film 1 are bonded together, and another step wherein the protective film 1 is removed. The tension of the laminate 7 at the time when the protective film 1 is removed is higher than the tension of the laminate 7 before the removal of the protective film 1.
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