发明申请
- 专利标题： THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS
- 专利标题（中）： 热接口装置，系统和方法
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申请号： US11668320申请日： 2007-01-29
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公开(公告)号： US20070119582A1公开(公告)日： 2007-05-31
- 发明人: Yuegang Zhang , C. Garner , Andrew Berlin , Valluri Rao , Bryan White , Paul Koning
- 申请人： Yuegang Zhang , C. Garner , Andrew Berlin , Valluri Rao , Bryan White , Paul Koning
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 主分类号： F28F1/14
- IPC分类号： F28F1/14
摘要：
An apparatus and system, as well as fabrication methods therefor, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the head spreader.
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