Disclosed herein is a heating apparatus designed to heat an object to be heated through induction heat generation of a heat generating part made of glasslike carbon, and that can rapidly raise or lower the temperature without contamination of the object which has a large area and is formed into a shape of a substrate such as a silicon wafer. The heating apparatus includes a heating container for receiving the object. The container is constructed such that at least a portion of the container formed into a shape of a plate is made of glasslike carbon, and that the portion of the container serves as a heat generating part. A high-frequency plate-shaped coil is disposed at the outside of the container while the coil is adjacent and is opposed to the heat generating part of the container, and which is wound approximately into a shape of a plate. The heating apparatus further includes a container-inside gas atmosphere control means for controlling the inside of the container to be maintained at a predetermined gas atmosphere. When electric current is supplied to the coil, heat is generated from the heat generating part through induction heat generation of the heat generating part, whereby the object is heated.