发明申请
- 专利标题： Micromechanical device and method for producing a micromechanical device
- 专利标题（中）： 微机械装置及其制造方法
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申请号： US11600672申请日： 2006-11-15
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公开(公告)号： US20070126069A1公开(公告)日： 2007-06-07
- 发明人: Joerg Muchow , Hubert Benzel , Markus Lang , Regina Grote , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Volkmar Senz
- 申请人： Joerg Muchow , Hubert Benzel , Markus Lang , Regina Grote , Simon Armbruster , Gerhard Lammel , Christoph Schelling , Volkmar Senz
- 优先权： DE102005055473.3 20051122
- 主分类号： H01L29/82
- IPC分类号： H01L29/82
摘要：
A micromechanical device and a method for producing this device are provided, the device having a sensor pattern that includes a spring pattern and a seismic mass. The seismic mass may be connected to the substrate material via the spring pattern, and a clearance may be provided in a direction perpendicular to the major substrate plane between the spring pattern and the substrate material. Alternatively, the spring pattern and the seismic mass may have a common, essentially continuous, front side surface.
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