发明申请
- 专利标题: Microelectronic package having a stiffening element and method of making same
- 专利标题(中): 具有加强元件的微电子封装及其制造方法
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申请号: US11292705申请日: 2005-12-01
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公开(公告)号: US20070126094A1公开(公告)日: 2007-06-07
- 发明人: Saeed Shojaie , Brian Taggart , Dale Hackitt
- 申请人: Saeed Shojaie , Brian Taggart , Dale Hackitt
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.