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1.发明申请Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same 审中-公开在铜线接合衬底上使用直接金表面光洁度，制作方法和测试方法公开(公告)号：US20060012042A1
公开(公告)日：2006-01-19
申请号：US11230858
申请日：2005-09-20
Applicant: Brian Taggert , Dale Hackitt , Dilip Misra
Inventor： Brian Taggert , Dale Hackitt , Dilip Misra
CPC classification number: H05K3/244 , C23C30/00 , H01L23/49811 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45169 , H01L2224/45644 , H01L2224/48091 , H01L2224/48227 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01028 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H05K3/3457 , H05K2203/049 , H05K2203/1572 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
Abstract translation: 描述了引线键合衬底。 引线键合衬底包括铜金属化和设置在铜金属化之上和之上的金表面光洁度。 金表面光洁度完成了一种结构，其包括用于基板的第一侧的引线键合的键合键和用于球附接在基板的第二侧上的至少一个。 还公开了一种形成表面光洁度的工艺。 还公开了一种在引线接合衬底上使用表面光洁度的电子封装。 还公开了一种组装电子封装的方法，其包括引线接合衬底上的表面光洁度。 还描述了包括引线键合衬底上的表面光洁度的计算系统。
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公开(公告)号：US20050285260A1
公开(公告)日：2005-12-29
申请号：US10877586
申请日：2004-06-25
Applicant: Dale Hackitt , Robert Nickerson , Brian Taggart
Inventor： Dale Hackitt , Robert Nickerson , Brian Taggart
IPC: H01L23/34 , H01L23/367 , H01L23/433 , H01L25/065
CPC classification number: H01L25/0657 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
Abstract translation: 本发明的实施例提供了一种微电子器件，其具有位于芯片与芯片电连接的芯片和衬底之间的散热器。 对于本发明的一个实施例，散热器是具有近似等于芯片的热膨胀系数的热膨胀系数的热塞。
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3.发明授权Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same 失效在铜线接合衬底上使用直接金表面光洁度，制作方法和测试方法公开(公告)号：US06972152B2
公开(公告)日：2005-12-06
申请号：US10608059
申请日：2003-06-27
Applicant: Brian Taggert , Dale Hackitt , Dilip K. Misra
Inventor： Brian Taggert , Dale Hackitt , Dilip K. Misra
CPC classification number: H05K3/244 , C23C30/00 , H01L23/49811 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45169 , H01L2224/45644 , H01L2224/48091 , H01L2224/48227 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01028 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H05K3/3457 , H05K2203/049 , H05K2203/1572 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
Abstract translation: 描述了引线键合衬底。 引线键合衬底包括铜金属化和设置在铜金属化之上和之上的金表面光洁度。 金表面光洁度完成了一种结构，其包括用于基板的第一侧的引线键合的键合键和用于球附接在基板的第二侧上的至少一个。 还公开了一种形成表面光洁度的工艺。 还公开了一种在引线接合衬底上使用表面光洁度的电子封装。 还公开了一种组装电子封装的方法，其包括引线接合衬底上的表面光洁度。 还描述了包括引线键合衬底上的表面光洁度的计算系统。
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Patent Agency Ranking
4.发明授权公开(公告)号：US07372133B2
公开(公告)日：2008-05-13
申请号：US11292705
申请日：2005-12-01
Applicant: Saeed Shojaie , Brian Taggart , Dale Hackitt
Inventor： Saeed Shojaie , Brian Taggart , Dale Hackitt
IPC: H01L23/495 , H01L23/28 , H01L23/498 , H01L21/50 , H01L21/48 , H01L21/44
CPC classification number: H01L23/3107 , H01L21/568 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.
Abstract translation: 一种形成引线框封装的方法，根据该方法形成的引线框封装以及结合引线框封装的系统。 引线框封装包括：金属化层，其包括桨状部分和包括接触引线的接触部分; 安装在所述桨部上的模具; 连接在管芯和相应的接触引线之间的引线; 封装模具，桨形部分，接触引线和引线键的包覆模制; 以及封装在包覆模制中且与引线框封装内的电路不连接的加强元件。
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5.发明申请USE OF GOLD SURFACE FINISH ON A COPPER WIRE-BOND SUBSTRATE, METHOD OF MAKING SAME, AND METHOD OF TESTING SAME 失效在铜箔基板上使用金表面处理，其制造方法及其测试方法公开(公告)号：US20050147801A1
公开(公告)日：2005-07-07
申请号：US10608059
申请日：2003-06-27
Applicant: Brian Taggert , Dale Hackitt , Dilip Misra
Inventor： Brian Taggert , Dale Hackitt , Dilip Misra
CPC classification number: H05K3/244 , C23C30/00 , H01L23/49811 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45169 , H01L2224/45644 , H01L2224/48091 , H01L2224/48227 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01028 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H05K3/3457 , H05K2203/049 , H05K2203/1572 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
Abstract translation: 描述了引线键合衬底。 引线键合衬底包括铜金属化和设置在铜金属化之上和之上的金表面光洁度。 金表面光洁度完成了一种结构，其包括用于基板的第一侧的引线键合的键合键和用于球附接在基板的第二侧上的至少一个。 还公开了一种形成表面光洁度的工艺。 还公开了一种在引线接合衬底上使用表面光洁度的电子封装。 还公开了一种组装电子封装的方法，其包括引线接合衬底上的表面光洁度。 还描述了包括引线键合衬底上的表面光洁度的计算系统。
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6.发明申请公开(公告)号：US20070126094A1
公开(公告)日：2007-06-07
申请号：US11292705
申请日：2005-12-01
Applicant: Saeed Shojaie , Brian Taggart , Dale Hackitt
Inventor： Saeed Shojaie , Brian Taggart , Dale Hackitt
IPC: H01L23/495
CPC classification number: H01L23/3107 , H01L21/568 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.
Abstract translation: 一种形成引线框封装的方法，根据该方法形成的引线框封装以及结合引线框封装的系统。 引线框封装包括：金属化层，其包括桨状部分和包括接触引线的接触部分; 安装在所述桨部上的模具; 连接在管芯和相应的接触引线之间的引线; 封装模具，桨形部分，接触引线和引线键的包覆模制; 以及封装在包覆模制中且与引线框封装内的电路不连接的加强元件。
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公开(公告)号：US07190068B2
公开(公告)日：2007-03-13
申请号：US10877586
申请日：2004-06-25
Applicant: Dale Hackitt , Robert Nickerson , Brian Taggart
Inventor： Dale Hackitt , Robert Nickerson , Brian Taggart
CPC classification number: H01L25/0657 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06589 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
Abstract translation: 本发明的实施例提供了一种微电子器件，其具有位于芯片与芯片电连接的芯片和衬底之间的散热器。 对于本发明的一个实施例，散热器是具有近似等于芯片的热膨胀系数的热膨胀系数的热塞。
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公开(公告)号：US5489805A
公开(公告)日：1996-02-06
申请号：US457794
申请日：1995-06-01
Applicant: Dale Hackitt , Behrooz Mehr
Inventor： Dale Hackitt , Behrooz Mehr
IPC: H01L21/56 , H01L23/433 , H01L23/34 , H01L23/495 , H05K7/20
CPC classification number: H01L21/565 , H01L23/4334 , H01L2224/48247 , H01L2924/3011
Abstract: An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.
Abstract translation: 一种集成电路封装，其包含散热器，该散热器具有从一片金属材料冲压的多个支脚。 散热器还具有多个槽，其允许塑料在封装的模制注射过程期间在集成电路组件的接合线之间流动。
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