Invention Application
US20070128770A1 MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW
有权
具有适用于减少包装袋的引线框架的微电子组件组件
- Patent Title: MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW
- Patent Title (中): 具有适用于减少包装袋的引线框架的微电子组件组件
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Application No.: US11672297Application Date: 2007-02-07
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Publication No.: US20070128770A1Publication Date: 2007-06-07
- Inventor: Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
- Applicant: Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
Public/Granted literature
- US07601562B2 Microelectronic component assemblies having lead frames adapted to reduce package bow Public/Granted day:2009-10-13
Information query
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