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1.发明授权Microelectronic component assemblies having lead frames adapted to reduce package bow 有权具有适于减少包装弓的引线框架的微电子部件组件公开(公告)号：US07601562B2
公开(公告)日：2009-10-13
申请号：US11672297
申请日：2007-02-07
IPC分类号： H05K5/06
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49544 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
摘要翻译： 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。
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2.发明申请MICROELECTRONIC COMPONENT ASSEMBLIES HAVING LEAD FRAMES ADAPTED TO REDUCE PACKAGE BOW 有权具有适用于减少包装袋的引线框架的微电子组件组件公开(公告)号：US20070128770A1
公开(公告)日：2007-06-07
申请号：US11672297
申请日：2007-02-07
申请人： Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
发明人： Steven Groothuis , Steven Smith , Steve Baughman , Bernard Ball , T. O'Connor
IPC分类号： H01L21/00
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49544 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
摘要翻译： 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。
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3.发明授权Microelectronic component assemblies having lead frames adapted to reduce package bow 有权具有适于减少包装弓的引线框架的微电子部件组件公开(公告)号：US07183485B2
公开(公告)日：2007-02-27
申请号：US10386757
申请日：2003-03-11
IPC分类号： H05K5/06
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49544 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the invention provides a microelectronic component assembly that includes spaced-apart first and second lead frame members. A packaged element is disposed between the lead frame members and attached thereto only by a plurality of elongate, flexible links that permit the packaged element to accommodate thermally induced stresses by floating with respect to the first and second lead frame members.
摘要翻译： 本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。 在一个具体实施方式中，本发明提供一种微电子部件组件，其包括间隔开的第一和第二引线框架部件。 封装元件设置在引线框架构件之间并且仅通过多个细长的柔性连接件连接，其允许封装元件通过相对于第一引线框架构件和第二引线框架构件浮动来适应热引起的应力。
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公开(公告)号：USD382689S
公开(公告)日：1997-08-26
申请号：US54957
申请日：1996-05-24
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