发明申请
US20070128806A1 High performance CMOS transistors using PMD liner stress 有权
使用PMD衬垫应力的高性能CMOS晶体管

High performance CMOS transistors using PMD liner stress
摘要:
A silicon nitrate layer (110) is formed over a transistor gate (40) and source and drain regions (70). The as-formed silicon nitride layer (110) comprises a first tensile stress and a high hydrogen concentration. The as-formed silicon nitride layer (110) is thermally annealed converting the first tensile stress into a second tensile stress that is larger than the first tensile stress. Following the thermal anneal, the hydrogen concentration in the silicon nitride layer (110) is greater than 12 atomic percent.
公开/授权文献
信息查询
0/0