发明申请
US20070131537A1 SYSTEM AND METHOD FOR PERFORMING SEMICONDUCTOR PROCESSING ON TARGET SUBSTRATE
有权
用于对目标基板进行半导体处理的系统和方法
- 专利标题: SYSTEM AND METHOD FOR PERFORMING SEMICONDUCTOR PROCESSING ON TARGET SUBSTRATE
- 专利标题(中): 用于对目标基板进行半导体处理的系统和方法
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申请号: US11626752申请日: 2007-01-24
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公开(公告)号: US20070131537A1公开(公告)日: 2007-06-14
- 发明人: KOICHI SAKAMOTO , Yamato Tonegawa , Takehiko Fujita
- 申请人: KOICHI SAKAMOTO , Yamato Tonegawa , Takehiko Fujita
- 申请人地址: JP Minato-Ku
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Minato-Ku
- 优先权: JP2001-225781 20010726
- 主分类号: C23C14/00
- IPC分类号: C23C14/00 ; C23C14/32
摘要:
A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a test target film formed on a target substrate (W) by a semiconductor process. The information processing section (51) calculates a positional correction amount of the target substrate (W) necessary for improving planar uniformity of the characteristic, based on values of the characteristic measured by the measuring section (40) at a plurality of positions on the test target film. The control section (52) controls a drive section (30A, 32A) of a transfer device (30), based on the positional correction amount, when the transfer device (30) transfers a next target substrate (W) to the support member (17) to perform the semiconductor process.