发明申请
- 专利标题: Methods of forming a conductive structure
- 专利标题(中): 形成导电结构的方法
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申请号: US11604825申请日: 2006-11-28
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公开(公告)号: US20070138126A1公开(公告)日: 2007-06-21
- 发明人: Keum-Joo Lee , In-Seak Hwang , Jong-Won Kim
- 申请人: Keum-Joo Lee , In-Seak Hwang , Jong-Won Kim
- 专利权人: Samsung Electronics Co. Ltd.
- 当前专利权人: Samsung Electronics Co. Ltd.
- 优先权: KR10-2005-0123896 20051215
- 主分类号: H01B13/00
- IPC分类号: H01B13/00 ; B44C1/22 ; C03C25/68 ; C03C15/00
摘要:
Example embodiments relate to a method of forming a conductive structure. Other example embodiments relate to a method of forming a conductive structure capable of storing or transmitting electric charges. In example embodiments, when a conductive structure including first and second conductive patterns extending in a first horizontal direction is formed, at least one of the first and second conductive patterns may decreases in size. When the conductive structure is vertically bisected in a second horizontal direction perpendicular to the first horizontal direction to form conductive members, a coupling effect generated between the conductive members adjacent to each other may be reduced.
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