发明申请
US20070138547A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
半导体器件及其制造方法

  • 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
  • 专利标题(中): 半导体器件及其制造方法
  • 申请号: US11608538
    申请日: 2006-12-08
  • 公开(公告)号: US20070138547A1
    公开(公告)日: 2007-06-21
  • 发明人: Kazutoshi Nakamura
  • 申请人: Kazutoshi Nakamura
  • 申请人地址: JP Tokyo
  • 专利权人: KABUSHIKI KAISHA TOSHIBA
  • 当前专利权人: KABUSHIKI KAISHA TOSHIBA
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2005-356109 20051209
  • 主分类号: H01L29/76
  • IPC分类号: H01L29/76
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要:
A semiconductor device comprises a semiconductor region of the first conduction type. A first main electrode is connected to the semiconductor region. A base region of the second conduction type is formed on the semiconductor region. A diffused region of the first conduction type is formed on the base region. A second main electrode is connected to the diffused region and the base region. A first trench is formed extending from a surface of the diffused region to the semiconductor region. A second trench is formed from the first trench deeper than the first trench. A gate electrode is formed on a side of the first trench via a first insulator film. A protruded electrode is formed in the second trench via a second insulator film as protruded lower than the gate electrode.
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