发明申请
US20070141840A1 Nickel silicide including indium and a method of manufacture therefor 有权
包括铟的硅化镍及其制造方法

Nickel silicide including indium and a method of manufacture therefor
摘要:
The present invention provides a semiconductor device, a method of manufacture therefore and a method for manufacturing an integrated circuit including the same. The semiconductor device, among other elements, may include a substrate (110), as well as a nickel silicide region (170) located over the substrate (110), the nickel silicide region (170) having an amount of indium located therein.
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