Invention Application
US20070148978A1 Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions
审中-公开
浆料组合物，使用浆料组合物研磨多晶硅层的方法和使用该浆料组合物制造半导体器件的方法
- Patent Title: Slurry compositions, methods of polishing polysilicon layers using the slurry compositions and methods of manufacturing semiconductor devices using the slurry compositions
- Patent Title (中): 浆料组合物，使用浆料组合物研磨多晶硅层的方法和使用该浆料组合物制造半导体器件的方法
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Application No.: US11642582Application Date: 2006-12-21
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Publication No.: US20070148978A1Publication Date: 2007-06-28
- Inventor: Eui-Jin Han , Nam-Soo Kim , Kyoung-Moon Kang , Dong-Jun Lee , Hyo-Sun Lee
- Applicant: Eui-Jin Han , Nam-Soo Kim , Kyoung-Moon Kang , Dong-Jun Lee , Hyo-Sun Lee
- Priority: KR2005-127509 20051222
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C03C15/00 ; C23F1/00 ; B44C1/22
Abstract:
A slurry composition, a method of polishing polysilicon layers using the slurry composition, and a method of manufacturing a semiconductor device using the same, wherein the slurry composition includes an abrasive in an amount of about 1 to about 20 percent by weight of the slurry composition, a non-ionic surfactant in an amount of about 0.005 to about 1 percent by weight of the slurry composition, and a solvent having a basic compound.
Information query
