Disclosed are a method of fabricating a quasi-substrate wafer (17) with a subcarrier wafer (4) and a growth layer (120), and a semiconductor body fabricated using such a quasi-substrate wafer (17). In the method of fabricating a quasi-substrate wafer (17), a growth substrate wafer (1) is fabricated that is provided with a separation zone (2) and comprises the desired material of the growth layer (120). The growth substrate wafer (1) is provided with a stress that counteracts a stress generated by the formation of the separation zone, and/or the stress generated by the formation of the separation zone is distributed, by structuring a first main face (101) of the growth substrate wafer (1) and/or the separation zone (2), to a plurality of subregions along the first main face (101). The growth substrate wafer (1) with separation zone (2) exhibits no or only slight bowing.