发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US11566879申请日： 2006-12-05
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公开(公告)号： US20070176272A1公开(公告)日： 2007-08-02
- 发明人: Hiroshi Saitoh , Toshihisa Suzuki , Shingo Sakakibara
- 申请人： Hiroshi Saitoh , Toshihisa Suzuki , Shingo Sakakibara
- 申请人地址： JP Hamamatsu-Shi
- 专利权人： YAMAHA CORPORATION
- 当前专利权人： YAMAHA CORPORATION
- 当前专利权人地址： JP Hamamatsu-Shi
- 优先权： JPP2005-351653 20051206; JPP2005-351654 20051206; JPP2005-376393 20051227; JPP2006-296013 20061031
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned
公开/授权文献
- US07646092B2 Semiconductor device and manufacturing method thereof 公开/授权日：2010-01-12