利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

27 条记录 (耗时 0.023 秒)

    Semiconductor device
    1.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US07560811B2

    公开(公告)日：2009-07-14

    申请号：US11634384

    申请日：2006-12-06

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/82

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20090096041A1

    公开(公告)日：2009-04-16

    申请号：US12333092

    申请日：2008-12-11

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/84

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/15153 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

    Semiconductor device
    6.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US20070210392A1

    公开(公告)日：2007-09-13

    申请号：US11634384

    申请日：2006-12-06

    申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

    IPC分类号： H01L29/82

    CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

    摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

    摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

    Vibration transducer
    8.
    发明申请
    Vibration transducer 审中-公开
    振动传感器

    公开(公告)号：US20090190782A1

    公开(公告)日：2009-07-30

    申请号：US12284776

    申请日：2008-09-25

    申请人： Tamito Suzuki ,  Yukitoshi Suzuki ,  Toshihisa Suzuki ,  Akiyoshi Sato

    发明人： Tamito Suzuki ,  Yukitoshi Suzuki ,  Toshihisa Suzuki ,  Akiyoshi Sato

    IPC分类号： H04R11/04

    CPC分类号： H04R19/005 ,  B81B3/0008 ,  B81B2201/0257 ,  H04R1/04 ,  H04R3/06 ,  H04R7/04 ,  H04R7/20 ,  H04R19/04 ,  H04R31/00 ,  H04R2307/201 ,  H04R2307/207

    摘要： A vibration transducer includes a substrate, a diaphragm formed using deposited films having conductive property, which has a plurality of arms extended from the center portion in a radial direction, a plate formed using deposited films having conductive property, and a plurality of diaphragm supports formed using deposited films, which join the arms so as to support the diaphragm above the substrate with a prescribed gap therebetween. A plurality of bumps is formed in the arms of the diaphragm so as to prevent the diaphragm from being attached to the substrate or the plate. When the diaphragm vibrates relative to the plate, an electrostatic capacitance therebetween is varied so as to detect variations of pressure applied thereto. In addition, a plurality of diaphragm holes is appropriately aligned in the arms of the diaphragm so as to improve the sensitivity while avoiding the occurrence of adherence.

    摘要翻译： 振动传感器包括：基板，使用具有导电性的沉积膜形成的隔膜，其具有从半径方向中央部延伸的多个臂，使用具有导电性的沉积膜形成的板，以及形成的多个隔膜支架 使用沉积膜，其连接臂，以便在基板之间以规定的间隙支撑隔膜。 在隔膜的臂上形成多个凸块，以防止隔膜附着在基板或板上。 当隔膜相对于板振动时，它们之间的静电电容变化，以便检测施加到其上的压力的变化。 此外，多个隔膜孔适当地对准在隔膜的臂中，以便提高灵敏度，同时避免粘附的发生。

    ELECTROACOUSTIC TRANSDUCER
    9.
    发明申请
    ELECTROACOUSTIC TRANSDUCER 失效
    电动传感器

    公开(公告)号：US20080181437A1

    公开(公告)日：2008-07-31

    申请号：US11839149

    申请日：2007-08-15

    申请人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

    发明人： Toshihisa Suzuki ,  Yuusaku Ebihara ,  Masayoshi Omura

    IPC分类号： H04R25/00

    CPC分类号： H04R19/016

    摘要： An electroacoustic transducer serving as a speaker or a microphone is reduced in size and weight and is capable of generating sound with relatively high sound pressure. It is constituted of a housing having a cavity having an opening in the exterior, a fixed electrode positioned opposite to the opening of the housing, a diaphragm having an electrode positioned between the opening and the fixed electrode, and an elastic deformation portion for supporting the diaphragm with respect to the housing and for allowing the diaphragm to vibrate in the thickness direction. The fixed electrode is electrically insulated from the electrode of the diaphragm. The diaphragm is distanced from the fixed electrode by means of the elastic deformation portion placed in the balanced state. When the elastic deformation portion is subjected to elastic deformation, the diaphragm vibrates with relatively large amplitude such that it comes in contact with the fixed electrode.

    摘要翻译： 用作扬声器或麦克风的电声换能器的尺寸和重量减小，并且能够产生具有较高声压的声音。 它由具有在外部具有开口的空腔的壳体，与壳体的开口相对定位的固定电极，具有位于开口和固定电极之间的电极的隔膜，以及用于支撑 隔膜相对于壳体并且允许隔膜在厚度方向上振动。 固定电极与隔膜的电极电绝缘。 隔膜通过置于平衡状态的弹性变形部分与固定电极分开。 当弹性变形部分发生弹性变形时，膜片以相对较大的振幅振动，使其与固定电极接触。