公开(公告)号：US08344489B2

公开(公告)日：2013-01-01

申请号：US12628127

申请日：2009-11-30

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

IPC分类号： H01L23/02

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C3/005 ,  B81C2203/0109 ,  B81C2203/054 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

摘要翻译： 本发明的半导体器件包括：在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖，其具有与基板相对并覆盖中空部的基本上板状的顶板部，并且具有至少一对侧壁部，该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位。

公开(公告)号：US20070176272A1

公开(公告)日：2007-08-02

申请号：US11566879

申请日：2006-12-05

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

IPC分类号： H01L23/02

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C3/005 ,  B81C2203/0109 ,  B81C2203/054 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned

摘要翻译： 本发明的半导体器件包括：在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖，其具有与基板相对并覆盖中空部的基本上板状的顶板部，并且具有至少一对侧壁部，该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位

公开(公告)号：US20090096041A1

公开(公告)日：2009-04-16

申请号：US12333092

申请日：2008-12-11

申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

IPC分类号： H01L29/84

CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/15153 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

公开(公告)号：US07560811B2

公开(公告)日：2009-07-14

申请号：US11634384

申请日：2006-12-06

申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

IPC分类号： H01L29/82

CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

公开(公告)号：US07646092B2

公开(公告)日：2010-01-12

申请号：US11566879

申请日：2006-12-05

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Shingo Sakakibara

IPC分类号： H01L23/12

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C3/005 ,  B81C2203/0109 ,  B81C2203/054 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

摘要翻译： 本发明的半导体器件包括：在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖，其具有与基板相对并覆盖中空部的基本上板状的顶板部，并且具有至少一对侧壁部，该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位。

公开(公告)号：US20070210392A1

公开(公告)日：2007-09-13

申请号：US11634384

申请日：2006-12-06

申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

IPC分类号： H01L29/82

CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

公开(公告)号：US20070158826A1

公开(公告)日：2007-07-12

申请号：US11616125

申请日：2006-12-26

申请人： Shingo Sakakibara ,  Hiroshi Saitoh

发明人： Shingo Sakakibara ,  Hiroshi Saitoh

IPC分类号： H01L23/34

CPC分类号： B81B7/0064 ,  H01L2224/48091 ,  H01L2924/3025 ,  H04R1/04 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a substrate, a semiconductor chip having a diaphragm, which vibrates in response to sound pressure variations, and a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is fixed to the surface of the circuit chip whose backside is mounted on the surface of the substrate. Herein, a plurality of connection terminals formed on the backside of the semiconductor chip are electrically connected to a plurality of electrodes running through the circuit chip. A ring-shaped resin sheet is inserted between the semiconductor chip and the circuit chip. The semiconductor chip and the circuit chip vertically joined together are stored in a shield case having a mount member (e.g., a stage) and a cover member, wherein connection terminals of the circuit chip are exposed to the exterior via through holes of the stage.

摘要翻译： 半导体器件包括：衬底，具有响应于声压变化而振动的隔膜的半导体芯片;以及与半导体芯片电连接以控制半导体芯片的电路芯片，其中将半导体芯片固定到 其背面安装在基板的表面上的电路芯片的表面。 这里，形成在半导体芯片的背面上的多个连接端子电连接到贯穿电路芯片的多个电极。 在半导体芯片和电路芯片之间插入环状树脂片。 垂直接合在一起的半导体芯片和电路芯片存储在具有安装构件（例如，台架）和盖构件的屏蔽壳体中，其中电路芯片的连接端子通过平台的通孔暴露于外部。

公开(公告)号：US20080056524A1

公开(公告)日：2008-03-06

申请号：US11899321

申请日：2007-09-05

申请人： Shingo Sakakibara ,  Hiroshi Saitoh

发明人： Shingo Sakakibara ,  Hiroshi Saitoh

IPC分类号： H04R19/04

CPC分类号： H04R19/04

摘要： A microphone package includes a housing, which has a cavity and a sound hole for allowing the cavity to communicate with the exterior, and a microphone chip, which is mounted on the mounting surface so as to detect sound within the cavity. The sound hole is opened in connection with the mounting surface and is surrounded by a projection wall projecting upwardly from the mounting surface at a prescribed position in proximity to the microphone chip.

摘要翻译： 麦克风封装包括壳体，其具有用于允许空腔与外部连通的空腔和声孔，以及安装在安装表面上以便检测腔内的声音的麦克风芯片。 声孔与安装表面相连开，并且由靠近麦克风芯片的规定位置处从安装表面向上突出的突出壁包围着。

公开(公告)号：US20090230487A1

公开(公告)日：2009-09-17

申请号：US11908590

申请日：2006-03-14

申请人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Masayoshi Omura

发明人： Hiroshi Saitoh ,  Toshihisa Suzuki ,  Masayoshi Omura

IPC分类号： H01L29/84 ,  H01L23/58 ,  H01L23/538 ,  H01L23/04 ,  H01L21/50

CPC分类号： B81C1/00333 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0264 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a substrate; a semiconductor chip that is fixed to a first surface of the substrate; a chip covering lid body that is provided on the first surface of the substrate so as to cover the semiconductor chip and that forms a hollow first space portion that surrounds the semiconductor chip, and in which there is provided a substantially cylindrical aperture portion that extends to the outer side of the first space portion and has an aperture end at a distal end thereof and that is connected to the first space portion; and a first resin mold portion that forms the first space portion via the chip covering lid body and covers the substrate such that the aperture end is exposed, and that fixes the substrate integrally with the chip covering lid body.

摘要翻译： 半导体器件包括：衬底; 固定到所述基板的第一表面的半导体芯片; 芯片覆盖盖体，其设置在基板的第一表面上以覆盖半导体芯片，并且形成围绕半导体芯片的中空的第一空间部分，并且其中设置有基本上圆柱形的开口部分，其延伸到 第一空间部分的外侧，并且在其远端具有开口端，并且连接到第一空间部分; 以及第一树脂模制部，其经由所述芯片盖体形成所述第一空间部，并且覆盖所述基板，使得所述开口端露出，并且将所述基板与所述芯片盖体一体地固定。

公开(公告)号：US07639922B2

公开(公告)日：2009-12-29

申请号：US10511831

申请日：2003-04-14

申请人： Hiroshi Saitoh ,  Hideaki Mita

发明人： Hiroshi Saitoh ,  Hideaki Mita

IPC分类号： H04N5/93 ,  G11B27/00 ,  H04N5/76

CPC分类号： G11B27/034 ,  G11B27/3027 ,  G11B27/3054 ,  G11B2220/90 ,  H04N5/232 ,  H04N5/77 ,  H04N5/782 ,  H04N5/9201

摘要： An image pick-up apparatus includes an image pick-up device of recording a video to generate a video signal, a photographer indication device of indicating a start of a recording and/or a stop of the recording, an AutoREC signal generation device of generating an AutoREC signal in conjunction with the start of the recording and/or the stop of the recording based on the indication, and an AutoREC signal multiplex device of multiplexing a generated AutoREC signal to a generated video signal.

摘要翻译： 图像拾取装置包括：用于记录视频以生成视频信号的图像拾取装置，指示开始记录和/或停止记录的拍摄者指示装置;生成 一个AutoREC信号结合记录的开始和/或基于该指示停止记录;以及一个AutoREC信号多路复用装置，将所生成的AutoREC信号复用到所生成的视频信号。