发明申请
US20070179259A1 Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith
有权
用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件
- 专利标题: Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith
- 专利标题(中): 用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件
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申请号: US11699370申请日: 2007-01-30
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公开(公告)号: US20070179259A1公开(公告)日: 2007-08-02
- 发明人: Shoichi Osada , Takayuki Aoki
- 申请人: Shoichi Osada , Takayuki Aoki
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 优先权: JP2006-022789 20060131; JP2007-016102 20070126
- 主分类号: C08L63/02
- IPC分类号: C08L63/02
摘要:
An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.