公开(公告)号：US20120295514A1

公开(公告)日：2012-11-22

申请号：US13574341

申请日：2011-01-24

Applicant: Willem Steven Paul Keppens ,  Tim Bollens ,  Felix Leopold Wackers ,  Hidetoshi Yokoi ,  Masahiro Yoneda ,  Takayuki Aoki

Inventor： Willem Steven Paul Keppens ,  Tim Bollens ,  Felix Leopold Wackers ,  Hidetoshi Yokoi ,  Masahiro Yoneda ,  Takayuki Aoki

IPC: A01K47/06

CPC classification number: A01K47/06

Abstract: This invention relates to a nest box (1) for bumblebees that provides sufficient ventilation inside the nest box (1). The provided nest box (1) with a bumblebees hive (2) inside resolves the problems of insufficient ventilation, by being mounted with a ventilation panel (14), comprising ventilation holes (13) in size(s) that enable ventilation but at the same time bumblebees from passing through.

Abstract translation: 本发明涉及一种用于在巢箱（1）内提供充分通气的用于大黄蜂的巢箱（1）。 所提供的具有大黄蜂蜂巢（2）的巢箱（1）通过安装有通风面板（14）来安装通风的问题，解决了通风不足的问题，该通风面板包括通风孔（13），其具有能够通风的通风孔， 同一时间的大黄蜂通过。

公开(公告)号：US08129020B2

公开(公告)日：2012-03-06

申请号：US12066057

申请日：2006-09-14

Applicant: Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

Inventor： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

IPC: C08J9/16 ,  B32B1/00

CPC classification number: B01J13/20 ,  B29C44/3461 ,  C08J9/143 ,  C08J9/32 ,  C08J2333/18 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.

Abstract translation: 具有高填充效率的热膨胀微球通过膨胀热膨胀性微球来制造，该微球包括热塑性树脂壳和封装在其中的发泡剂，其沸点不高于热塑性树脂的软化点，并且具有平均粒径 1至100微米，温度不低于其膨胀起始温度，热膨胀微球体的空隙率不高于0.70。

公开(公告)号：US07943706B2

公开(公告)日：2011-05-17

申请号：US11386667

申请日：2006-03-23

Applicant: Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

Inventor： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC: C08F283/00 ,  B32B27/38 ,  C08G59/50

CPC classification number: H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

Abstract: An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract translation: 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US20100180995A1

公开(公告)日：2010-07-22

申请号：US12091538

申请日：2006-10-24

Applicant: Hiroyuki Teratani ,  Toshiaki Masuda ,  Kenichi Kitano ,  Katsushi Miki ,  Takayuki Aoki ,  Takeshi Inohara

Inventor： Hiroyuki Teratani ,  Toshiaki Masuda ,  Kenichi Kitano ,  Katsushi Miki ,  Takayuki Aoki ,  Takeshi Inohara

IPC: B60C5/12 ,  B32B1/00 ,  B01J13/18 ,  B60C19/00

CPC classification number: B01J13/185 ,  B29D30/04 ,  B60C17/01 ,  B60C17/066 ,  Y10T152/10054 ,  Y10T428/1397 ,  Y10T428/2998

Abstract: In heat-expandable microspheres as a starting material for hollow fine particles, which have excellent performances required for giving not only a durability in steady running region but also a durability in high-speed running region to a tire-rim assembly, and each consisting of an outer shell made of a thermoplastic resin obtained by polymerizing a monomer component in the presence of a polymerization initiator, and a foaming agent encapsulated in the outer shell and having a boiling point not higher than a softening point of the thermoplastic resin, the polymerization initiator comprises a peroxydicarbonate as an essential component, and the foaming agent comprises a fluorine-containing compound having an ether structure and a carbon number of 2-10 and containing no chlorine atom and bromine atom.

Abstract translation: 在作为中空微粒的原料的热膨胀性微球中，其具有优异的性能，其不仅在稳定运行区域中不仅具有耐久性，而且在高速运行区域中对轮胎 - 轮辋组件的耐久性，并且各自由 由在聚合引发剂存在下聚合单体成分而获得的热塑性树脂制成的外壳和封装在外壳中并且沸点不高于热塑性树脂的软化点的发泡剂，聚合引发剂 以过氧化二碳酸酯为必须成分，发泡剂含有具有醚结构，碳数为2-10且不含氯原子和溴原子的含氟化合物。

公开(公告)号：US20090320772A1

公开(公告)日：2009-12-31

申请号：US12485276

申请日：2009-06-16

Applicant: Tadafumi Hirose ,  Hitoshi Yuki ,  Takayuki Aoki ,  Ryosuke Shibata ,  Hiroki Iikura ,  Makoto Uchimi ,  Masashi Kai

Inventor： Tadafumi Hirose ,  Hitoshi Yuki ,  Takayuki Aoki ,  Ryosuke Shibata ,  Hiroki Iikura ,  Makoto Uchimi ,  Masashi Kai

IPC: F01P1/06 ,  F01P7/04

CPC classification number: F02B63/04 ,  F01P5/06 ,  F02B63/047

Abstract: Engine cooling structure directs cooling air, introduced into a case by operation of a fan, to a cylinder block of an engine and then discharges the cooling air out of the case through an outlet port along meandering flow passages. Case cooling structure directs cooling along the inner surface of the case. Further cooling flow passage directs the air to vertically-oriented heat radiating fins so that the cooling air flows upward along the fins and then is discharged through the outlet port. Metal cooling-fan cover is supported by the lower cover via mounting members, and a resin-made cover guide is fastened to the engine together with supporting portions and interposed between the fan cover and the engine.

Abstract translation: 发动机冷却结构将通过风扇的操作引入壳体的冷却空气引导到发动机的气缸体，然后通过出口沿着弯曲的流动通道将冷却空气从壳体排出。 外壳冷却结构沿壳体的内表面引导冷却。 进一步的冷却流路将空气引导到垂直取向的散热片，使得冷却空气沿翅片向上流动，然后通过出口排出。 金属冷却风扇盖由下盖通过安装构件支撑，树脂制的盖引导件与支撑部分一起固定在发动机上，并插在风扇盖和发动机之间。

公开(公告)号：US20090280328A1

公开(公告)日：2009-11-12

申请号：US12066057

申请日：2006-09-14

Applicant: Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

Inventor： Toshiaki Masuda ,  Ichiro Takahara ,  Kenichi Kitano ,  Katsushi Miki ,  Takeshi Inohara ,  Takayuki Aoki

IPC: B32B1/00 ,  C08J9/16

CPC classification number: B01J13/20 ,  B29C44/3461 ,  C08J9/143 ,  C08J9/32 ,  C08J2333/18 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2985 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.

Abstract translation: 本发明提供具有高填充效率的热膨胀微球及其制造方法。 热膨胀微球体是通过膨胀包含热塑性树脂壳和封装在其中的沸点不高于热塑性树脂的软化点的发泡剂的热膨胀性微球而制成的，平均粒径为1〜100 微米，其温度不低于其膨胀起始温度，热膨胀微球导致不高于0.70的空隙率。

公开(公告)号：US20080255283A1

公开(公告)日：2008-10-16

申请号：US12026433

申请日：2008-02-05

Applicant: Takayuki Aoki ,  Tadaharu Ikeda

Inventor： Takayuki Aoki ,  Tadaharu Ikeda

IPC: C08K3/36 ,  C08K5/05 ,  H01L23/29 ,  C08K5/06

CPC classification number: H01L23/293 ,  C08K3/013 ,  C08K5/0008 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) an internal parting agent having a melting point of 50-90° C. is included. In another embodiment, (I) inorganic whisker fibers having an average fineness of 0.05-50 μm and an average length of 1.0-1,000 μm are included.

Abstract translation: 提供一种热固性环氧树脂组合物，其包含（A）通过三嗪衍生的环氧树脂与酸酐反应获得的反应产物，（C）反射剂，（D）无机填料和（E）固化催化剂。 在一个实施方案中，包括（B）熔点为50-90℃的内部脱模剂。 在另一个实施方案中，包括（I）平均纤度为0.05-50μm，平均长度为1.0-1,000μm的无机须须纤维。

公开(公告)号：US06723452B2

公开(公告)日：2004-04-20

申请号：US10196222

申请日：2002-07-17

Applicant: Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

Inventor： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC: H01L2912

CPC classification number: H01L23/293 ,  C08G59/20 ,  C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L2666/22 ,  H01L2924/00

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract translation: 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。

公开(公告)号：US06177489B1

公开(公告)日：2001-01-23

申请号：US09003517

申请日：1998-01-06

Applicant: Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

Inventor： Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

IPC: C08L6302

CPC classification number: H01L23/295 ,  C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08K5/20 ,  C08K5/5397 ,  C08K5/54 ,  C08L63/00 ,  C09K21/14 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/22 ,  H01L2924/00

Abstract: A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.

Abstract translation: 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。

公开(公告)号：US6162878A

公开(公告)日：2000-12-19

申请号：US310999

申请日：1999-05-13

Applicant: Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Kazutoshi Tomiyoshi ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC: C08G59/08 ,  C08G59/20 ,  C08G59/40 ,  C08G59/62 ,  C08K3/00 ,  C08L61/04 ,  C08L63/00 ,  C08L83/04 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  C08G59/08 ,  C08G59/4085 ,  C08L61/04 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract translation: 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。