发明申请
- 专利标题： Circuit board structure embedded with semiconductor chips
- 专利标题（中）： 电路板结构嵌入半导体芯片
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申请号： US11544199申请日： 2006-10-05
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公开(公告)号： US20070181995A1公开(公告)日： 2007-08-09
- 发明人: Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
- 申请人： Shih Ping Hsu , Chung Cheng Lien , Shang Wei Chen
- 优先权： TW095104315 20060209
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.
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