公开(公告)号：US20070241444A1

公开(公告)日：2007-10-18

申请号：US11734768

申请日：2007-04-12

申请人： Shih-Ping HSU ,  Chung Cheng Lien ,  Zhao Chong Zeng ,  Shang Wei Chen

发明人： Shih-Ping HSU ,  Chung Cheng Lien ,  Zhao Chong Zeng ,  Shang Wei Chen

IPC分类号： H01L23/52

CPC分类号： H01L23/13 ,  H01L2924/0002 ,  H01L2924/15157 ,  H01L2924/00

摘要： A carrier board structure with a semiconductor chip embedded therein and a method for fabricating the same are proposed. A rectangular cavity is formed at a predetermined position of the carrier board, and at least a breach is formed at a corner of the rectangular cavity, wherein the breach is composed of a plurality of drilling holes. Thus, the breach is capable of providing the rectangular cavity with a larger space for receiving a semiconductor chip in the rectangular cavity, when in the process of disposing the semiconductor chip into the rectangular cavity.

摘要翻译： 提出了其中嵌有半导体芯片的载体板结构及其制造方法。 在承载板的预定位置处形成矩形空腔，并且在矩形空腔的角部至少形成有破裂，其中，所述突破由多个钻孔构成。 因此，当在将半导体芯片设置到矩形空腔中的过程中，该突破能够为矩形空腔提供更大的空间，用于接收矩形空腔中的半导体芯片。

公开(公告)号：US07863729B2

公开(公告)日：2011-01-04

申请号：US12427668

申请日：2009-04-21

申请人： Shih Ping Hsu ,  Chung Cheng Lien ,  Shang Wei Chen

发明人： Shih Ping Hsu ,  Chung Cheng Lien ,  Shang Wei Chen

IPC分类号： H01L23/12 ,  H01L23/053

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09809 ,  H05K2201/10674 ,  H01L2924/00

摘要： A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.

摘要翻译： 提出了一种嵌入半导体芯片的电路板结构。 半导体芯片被容纳在支撑板的空腔中。 在支撑板和半导体芯片上形成电介质层和电路层。 在电介质层中形成多个中空导电通孔，用于将电路层与半导体芯片电连接。 通过提供本发明的中空导电通孔，可以防止不同膨胀系数和热应力的分离结果，从而确保产品的电功能。

公开(公告)号：US20070181995A1

公开(公告)日：2007-08-09

申请号：US11544199

申请日：2006-10-05

申请人： Shih Ping Hsu ,  Chung Cheng Lien ,  Shang Wei Chen

发明人： Shih Ping Hsu ,  Chung Cheng Lien ,  Shang Wei Chen

IPC分类号： H01L23/12

CPC分类号： H01L23/5389 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09809 ,  H05K2201/10674 ,  H01L2924/00

摘要： A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.

摘要翻译： 提出了一种嵌入半导体芯片的电路板结构。 半导体芯片被容纳在支撑板的空腔中。 在支撑板和半导体芯片上形成电介质层和电路层。 在电介质层中形成多个中空导电通孔，用于将电路层与半导体芯片电连接。 通过提供本发明的中空导电通孔，可以防止不同膨胀系数和热应力的分离结果，从而确保产品的电功能。