Invention Application
US20070182016A1 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
有权
制造具有降低的热膨胀的相同的低吸湿电路化子串的方法
- Patent Title: Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion
- Patent Title (中): 制造具有降低的热膨胀的相同的低吸湿电路化子串的方法
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Application No.: US11730942Application Date: 2007-04-05
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Publication No.: US20070182016A1Publication Date: 2007-08-09
- Inventor: Robert Japp , Irving Memis , Kostas Papathomas
- Applicant: Robert Japp , Irving Memis , Kostas Papathomas
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.
Public/Granted literature
- US07416972B2 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion Public/Granted day:2008-08-26
Information query
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