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    DRILL STACK FORMATION
    1.
    发明申请
    DRILL STACK FORMATION 审中-公开
    钻井堆积形成

    公开(公告)号：US20080032155A1

    公开(公告)日：2008-02-07

    申请号：US11866629

    申请日：2007-10-03

    申请人： Robert Japp ,  Gregory Kevern ,  Francis Poch

    发明人： Robert Japp ,  Gregory Kevern ,  Francis Poch

    IPC分类号： B32B15/08

    CPC分类号： B32B7/12 ,  B23B35/00 ,  B23B2222/21 ,  B23B2222/41 ,  B23B2222/64 ,  B23B2240/21 ,  B32B7/06 ,  B32B15/01 ,  B32B15/04 ,  B32B15/20 ,  H05K3/0047 ,  H05K3/44 ,  H05K2203/1536 ,  Y10T83/0476 ,  Y10T156/1057 ,  Y10T156/1184 ,  Y10T408/03 ,  Y10T428/12569 ,  Y10T428/14 ,  Y10T428/1495 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2804

    摘要： A structure. The structure includes a stack of two or more sheets. Successive sheets in each pair of successive sheets of the stack are adhesively coupled to each other by an adhesive layer consisting of a removable adhesive that is removable if heated to an elevated temperature at which the removable adhesive melts. The removable adhesive is also disposed on top and bottom surfaces of the stack. The removable adhesive consists of a liquid while adhesively coupling the successive sheets to each other. A first surface of a first layer coupled with the removable adhesive to a first surface of the stack. A first surface of a second layer is coupled with the removable adhesive to a second surface of the stack. The first and second layers are adapted to prevent burr formation in a hole subsequently drilled through the stack.

    摘要翻译： 一个结构。 该结构包括两个或多个片材的堆叠。 堆叠的每对连续片中的连续片通过由可移除的粘合剂组成的粘合剂层彼此粘合地连接，所述粘合剂层如果被加热到可移除的粘合剂熔化的升高的温度下是可去除的。 可移动粘合剂也设置在堆叠的顶表面和底表面上。 可移除的粘合剂由液体组成，同时将连续的片材彼此粘合地连接。 第一层的第一表面与可移除粘合剂结合到堆叠的第一表面。 第二层的第一表面与可移除的粘合剂结合到堆叠的第二表面。 第一层和第二层适于防止随后在堆叠中钻孔的孔中形成毛刺。

    Method of making circuitized substrate
    6.
    发明申请
    Method of making circuitized substrate 有权
    制造电路化基板的方法

    公开(公告)号：US20070166944A1

    公开(公告)日：2007-07-19

    申请号：US11324432

    申请日：2006-01-04

    申请人： Robert Japp ,  John Lauffer ,  Voya Markovich ,  William Wilson

    发明人： Robert Japp ,  John Lauffer ,  Voya Markovich ,  William Wilson

    IPC分类号： H01L21/20

    CPC分类号： H05K3/4641 ,  H05K3/429 ,  H05K2203/068

    摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.

    摘要翻译： 一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到 另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。 导电通孔形成在接合结构内，以耦合所选择的结构导电层。 通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。