发明申请
- 专利标题: Semiconductor device and method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11785633申请日: 2007-04-19
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公开(公告)号: US20070196960A1公开(公告)日: 2007-08-23
- 发明人: Kenji Kasahara , Shunpei Yamazaki
- 申请人: Kenji Kasahara , Shunpei Yamazaki
- 申请人地址: JP Atsugi-shi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2001-200319 20010702
- 主分类号: H01L21/70
- IPC分类号: H01L21/70
摘要:
The lip-type seal of the present invention is a lip-type seal with which the outer periphery of a rotational shaft (S) supported by a predetermined housing (H) is sealed. The lip-type seal is made up of a first annular reinforcing member (11) and a first sealing member (12). The first reinforcing member (11) includes a wall surface part (11a) defining a hole through which the rotational shaft (S) is passed and a cylindrical part (11b) bent from the outer edge of the wall surface part (11a). The first sealing member (12) includes an annular base (12a) that is joined to the housing (H), a first lip part (12b) that extends almost conically from the base (12a) inwardly in the radial direction and that comes into contact with the rotational shaft (S), and an annular concave part (12c) formed in the base (12a) so as to detachably fit the cylindrical part (11b). Accordingly, a desired sealing capability can be secured, and the components can be easily assembled, disassembled, and recycled.
公开/授权文献
- US07998845B2 Semiconductor device and method of manufacturing the same 公开/授权日:2011-08-16
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