To provide a process for producing a fluorocarbon film, which is capable of constantly forming a fluorocarbon film excellent in durability and functionality. The process for producing a fluorocarbon film of the present invention is a process for producing a fluorocarbon film at least a part of which is chemically bonded to a substrate surface, and is characterized by conducting, in sequence, step (a) for applying plasma to a substrate surface in a continuous or pulse manner to form active points on the substrate surface and step (b) for applying plasma to the substrate surface in a continuous or pulse manner in the presence of a gas of a fluorocompound represented by the formula CxFy and/or CxFyOz under such a condition that active species impinge on the substrate surface at a relatively lower collision energy than in step (a).