发明申请
US20070205430A1 METHOD AND STRUCTURE OF REFRACTORY METAL REACH THROUGH IN BIPOLAR TRANSISTOR
审中-公开
在双极晶体管中通过金属REACH的方法和结构
- 专利标题: METHOD AND STRUCTURE OF REFRACTORY METAL REACH THROUGH IN BIPOLAR TRANSISTOR
- 专利标题(中): 在双极晶体管中通过金属REACH的方法和结构
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申请号: US11276510申请日: 2006-03-03
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公开(公告)号: US20070205430A1公开(公告)日: 2007-09-06
- 发明人: David Collins , Louis Lanzerotti , Edward Nowark , Steven Voldman
- 申请人: David Collins , Louis Lanzerotti , Edward Nowark , Steven Voldman
- 主分类号: H01L31/111
- IPC分类号: H01L31/111
摘要:
Structure and method of structure in which a contact, e.g., low resistance; ohmic; resulting in Schottky isolation, is coupled to a doped region that is buried in a substrate. In a bipolar transistor having a collector region formed below an upper surface of a substrate, a trench is formed through a portion of the collector region, and the sidewall(s) and/or bottom of the trench are doped, e.g., by ion implantation or dopant. The trench is filled with a conductor, e.g., a refractory metal such as tungsten.
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