发明申请
- 专利标题: Semiconductor device and method of producing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11714214申请日: 2007-03-06
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公开(公告)号: US20070210330A1公开(公告)日: 2007-09-13
- 发明人: Tetsuya Hayashi , Masakatsu Hoshi , Yoshio Shimoida , Hideaki Tanaka , Shigeharu Yamagami
- 申请人: Tetsuya Hayashi , Masakatsu Hoshi , Yoshio Shimoida , Hideaki Tanaka , Shigeharu Yamagami
- 专利权人: NISSAN MOTOR CO., LTD.
- 当前专利权人: NISSAN MOTOR CO., LTD.
- 优先权: JP2006-066492 20060310
- 主分类号: H01L29/732
- IPC分类号: H01L29/732 ; H01L21/8234
摘要:
A semiconductor device, includes: a first conductivity type semiconductor base having a main face; a hetero semiconductor region contacting the main face of the semiconductor base and forming a hetero junction in combination with the semiconductor base, the semiconductor base and the hetero semiconductor region in combination defining a junction end part; a gate insulating film defining a junction face in contact with the semiconductor base and having a thickness; and a gate electrode disposed adjacent to the junction end part via the gate insulating film and defining a shortest point in a position away from the junction end part by a shortest interval, a line extending from the shortest point to a contact point vertically relative to the junction face, forming such a distance between the contact point and the junction end part as to be smaller than the thickness of the gate insulating film contacting the semiconductor base.
公开/授权文献
- US07671383B2 Semiconductor device and method of producing the same 公开/授权日:2010-03-02
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