Invention Application
- Patent Title: PACKAGE STRUCTURE FOR ELECTRONIC DEVICE
- Patent Title (中): 电子设备的包装结构
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Application No.: US11554597Application Date: 2006-10-31
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Publication No.: US20070210429A1Publication Date: 2007-09-13
- Inventor: Ji-Cheng Lin , Shyh-Ming Chang
- Applicant: Ji-Cheng Lin , Shyh-Ming Chang
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW95107544 20060307
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A package structure with embedded electronic devices is provided. The package structure includes a substrate, a multi-layered circuit board, an adhesive film and at least an electronic device. The electronic device is disposed on the substrate. The electronic device is press-adhered to the multi-layered circuit board through the adhesive film and the composite bump thereon, so that the electronic device is embedded within the package structure and between the substrate and the circuit board. Due to the deformity of the composite bump, the electronic device is protected from being cracking in the pressing process.
Public/Granted literature
- US07531900B2 Package structure for electronic device Public/Granted day:2009-05-12
Information query
IPC分类:
