发明申请
- 专利标题: Propylene Resin Composition and Molding Thereof
- 专利标题(中): 丙烯树脂组合物及其成型
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申请号: US10592797申请日: 2005-02-04
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公开(公告)号: US20070238828A1公开(公告)日: 2007-10-11
- 发明人: Akihiro Matsuki , Shinichi Kanamaru , Yutaka Fukuyama , Nobutake Mise , Eihachi Takamura , Koichi Nakayama
- 申请人: Akihiro Matsuki , Shinichi Kanamaru , Yutaka Fukuyama , Nobutake Mise , Eihachi Takamura , Koichi Nakayama
- 申请人地址: JP Tokyo 108-0014
- 专利权人: MITSUBISHI CHEMICAL CORPORATION
- 当前专利权人: MITSUBISHI CHEMICAL CORPORATION
- 当前专利权人地址: JP Tokyo 108-0014
- 优先权: JP2004-073100 20040315
- 国际申请: PCT/JP05/01690 WO 20050204
- 主分类号: C08K7/06
- IPC分类号: C08K7/06 ; C08L23/10 ; C08L53/00 ; C09C1/48
摘要:
To provide a propylene resin composition excellent in both the electroconductivity and moldability and excellent in their balance, and a molded product thereof. A propylene resin composition comprising from 50 to 98 wt % of a propylene resin having a MFR of from 5 to 300 g/10 min, and from 2 to 50 wt % of carbon black having a 24M4DBP absorption of at least 130 cm3/100 g, a dehydrogenation amount of at most 1.2 mg/g at 1,500° C. for 30 minutes and a crystallite size (Lc) of from 10 to 17 Å. A propylene resin molded product which is a propylene resin molded product obtained by molding such a propylene resin composition and which has a volume resistivity of from 102 to 109 Ω·cm and a MFR of from 1 to 80 g/10 min.
公开/授权文献
- US07687566B2 Propylene resin composition and molding thereof 公开/授权日:2010-03-30
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