发明申请
US20070246439A1 Gap filling method, method for forming semiconductor memory device using the same, and semiconductor device having a filled gap
失效
间隙填充方法,使用其的半导体存储器件的形成方法以及具有填充间隙的半导体器件
- 专利标题: Gap filling method, method for forming semiconductor memory device using the same, and semiconductor device having a filled gap
- 专利标题(中): 间隙填充方法,使用其的半导体存储器件的形成方法以及具有填充间隙的半导体器件
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申请号: US11783975申请日: 2007-04-13
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公开(公告)号: US20070246439A1公开(公告)日: 2007-10-25
- 发明人: Jin-Il Lee , Choong-Man Lee , Sung-Lae Cho , Sang-Wook Lim , Hye-Young Park , Young-Lim Park
- 申请人: Jin-Il Lee , Choong-Man Lee , Sung-Lae Cho , Sang-Wook Lim , Hye-Young Park , Young-Lim Park
- 优先权: KR2006-36699 20060424
- 主分类号: B44C1/22
- IPC分类号: B44C1/22 ; C03C25/68 ; C23F1/00
摘要:
A gap filling method and a method for forming a memory device, including forming an insulating layer on a substrate, forming a gap region in the insulating layer, and repeatedly forming a phase change material layer and etching the phase change material layer to form a phase change material layer pattern in the gap region.
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