发明申请
- 专利标题： Method of polishing a tungsten-containing substrate
- 专利标题（中）： 抛光含钨基材的方法
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申请号： US11881338申请日： 2007-07-26
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公开(公告)号： US20070266641A1公开(公告)日： 2007-11-22
- 发明人: Robert Vacassy , Dinesh Khanna , Alexander Simpson
- 申请人： Robert Vacassy , Dinesh Khanna , Alexander Simpson
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 主分类号： C09C1/68
- IPC分类号： C09C1/68
摘要：
The invention provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates. The composition comprises a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom.
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