发明申请
- 专利标题: STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- 专利标题(中): 半导体器件的结构及其制造方法
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申请号: US11470627申请日: 2006-09-07
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公开(公告)号: US20070267697A1公开(公告)日: 2007-11-22
- 发明人: Huai-Yuan Tseng , Chen-Pang Kung , Horng-Chih Lin , Ming-Hsien Lee
- 申请人: Huai-Yuan Tseng , Chen-Pang Kung , Horng-Chih Lin , Ming-Hsien Lee
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 优先权: TW95117253 20060516
- 主分类号: H01L27/01
- IPC分类号: H01L27/01
摘要:
A structure of semiconductor device including an insulation substrate is provided. A channel layer is disposed on the insulation substrate. A plurality of doped layers is disposed on the insulation substrate, and protrudes from the channel layer. The doped layers form at least two source/drain electrode (S/D electrode) pairs, and each of the S/D electrode pairs has a different extension direction with respect to the channel layer. A gate dielectric layer is disposed on the channel layer. A gate layer is disposed on the gate dielectric layer. Preferably, for example, the extension direction of at least one of the S/D electrode pairs is a first direction, and the extension direction of at least another one of the S/D electrode pairs is a second direction.
公开/授权文献
- US07504694B2 Structure of semiconductor device 公开/授权日:2009-03-17
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