发明申请
- 专利标题： PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES
- 专利标题（中）： 包装装置和形成包装装置的方法
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申请号： US11383922申请日： 2006-05-17
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公开(公告)号： US20070267737A1公开(公告)日： 2007-11-22
- 发明人: Hsien-Wei Chen , Hsueh-Chung Chen , Yi-Lung Cheng
- 申请人： Hsien-Wei Chen , Hsueh-Chung Chen , Yi-Lung Cheng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/15
- IPC分类号： H01L23/15
摘要：
Packaged devices and methods of forming packaged devices are provided. At least one device is disposed on a substrate. The material layer encapsulates the device and covers at least a portion of the substrate, wherein the material layer comprises at least a first portion adjacent to the device and a second portion over the first portion. The second portion has a thermal conductivity higher than a thermal conductivity of the first portion.
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