发明申请
- 专利标题： Electronic device substrate, electronic device and methods for making same
- 专利标题（中）： 电子器件基板，电子器件及其制造方法
-
申请号： US11645948申请日： 2006-12-27
-
公开(公告)号： US20070269590A1公开(公告)日： 2007-11-22
- 发明人: Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- 申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- 申请人地址： JP TOKYO JP KANAGAWA
- 专利权人： HITACHI CABLE, LTD.,NEC ELECTRONICS CORPORATION
- 当前专利权人： HITACHI CABLE, LTD.,NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP TOKYO JP KANAGAWA
- 优先权： JP2006-141862 20060522
- 主分类号： B05D5/12
- IPC分类号： B05D5/12
摘要：
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
公开/授权文献
信息查询
