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发明申请
US20070269949A1 Method of fabricating a semiconductor device with a trench isolation structure and resulting semiconductor device 有权
制造具有沟槽隔离结构和所得半导体器件的半导体器件的方法

Method of fabricating a semiconductor device with a trench isolation structure and resulting semiconductor device
摘要：
The present fabrication method includes the steps of: providing a nitride film in a main surface of a semiconductor substrate; providing an upper trench, with the nitride film used as a mask; filling the upper trench with an oxide film introduced therein; removing the oxide film to expose at least a portion of a bottom of the upper trench and allowing a remainder of the oxide film to serve as a sidewall; providing a lower trench in a bottom of the upper trench, with the sidewall used as a mask; and with the upper trench having the sidewall remaining therein, providing an oxide film in the upper trench and the lower trench. This can provide a semiconductor device fabrication method and a semiconductor device preventing a contact from penetrating the device in an interconnection process.
摘要（中）：

本发明的制造方法包括以下步骤：在半导体衬底的主表面上设置氮化物膜; 提供上部沟槽，其中所述氮化物膜用作掩模; 用引入其中的氧化膜填充上沟槽; 去除所述氧化物膜以暴露所述上部沟槽的底部的至少一部分并且允许所述氧化膜的其余部分用作侧壁; 在所述上沟槽的底部提供下沟槽，所述侧壁用作掩模; 并且具有保留其侧壁的上沟槽，在上沟槽和下沟槽中提供氧化膜。 这可以提供半导体器件制造方法和半导体器件，以防止接触在互连过程中穿透器件。

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