发明申请
US20070296007A1 Shared ground contact isolation structure for high-density magneto-resistive RAM 审中-公开
用于高密度磁阻RAM的共享接地隔离结构

  • 专利标题: Shared ground contact isolation structure for high-density magneto-resistive RAM
  • 专利标题(中): 用于高密度磁阻RAM的共享接地隔离结构
  • 申请号: US11369195
    申请日: 2006-03-06
  • 公开(公告)号: US20070296007A1
    公开(公告)日: 2007-12-27
  • 发明人: Human ParkUlrich Klostermann
  • 申请人: Human ParkUlrich Klostermann
  • 优先权: DE102005046774.1 20050929
  • 主分类号: H01L29/772
  • IPC分类号: H01L29/772 G11C11/00
Shared ground contact isolation structure for high-density magneto-resistive RAM
摘要:
A buried ground contact that connects the ground electrodes of transistors in adjacent memory cells that are separated by an isolation region is described. In some embodiments, the buried ground contact passes beneath the isolation region that separates cells to electrically connect the drain regions of transistors in adjacent cells. The buried ground may be connected to a metal ground line through via connections at intervals, outside of the active cell area. Use of this buried ground contact eliminates the need for individual ground connections to each cell, leading to a substantial reduction in cell size, and a consequent increase in cell density. The buried ground contacts of the invention can be used with a variety of devices, including MRAM and PCRAM devices.
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