发明申请
- 专利标题： Method and System for Controlled Plating of Vias
- 专利标题（中）： 通孔控制电镀方法与系统
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申请号： US11425799申请日： 2006-06-22
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公开(公告)号： US20070298601A1公开(公告)日： 2007-12-27
- 发明人: Roger A. Booth , Matthew S. Doyle , Jesse M. Hefner , Lynn R. Landlin , Thomas W. Liang , Ankur K. Patel
- 申请人： Roger A. Booth , Matthew S. Doyle , Jesse M. Hefner , Lynn R. Landlin , Thomas W. Liang , Ankur K. Patel
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
Methods and systems for controlled formation of a resist in a via. In one embodiment, a method for plating at least a portion of the inside of a via formed in an object may include filling the via with a resist capable of selective three-dimensional polymerization. The resist may be selectively polymerized, and developed. When the resist is developed, only a portion of the resist is removed according to whether the portion is polymerized, thereby leaving a remaining portion in the via and forming a desired structure in the via.