摘要:
Methods and systems for controlled formation of a resist in a via. In one embodiment, a method for plating at least a portion of the inside of a via formed in an object may include filling the via with a resist capable of selective three-dimensional polymerization. The resist may be selectively polymerized, and developed. When the resist is developed, only a portion of the resist is removed according to whether the portion is polymerized, thereby leaving a remaining portion in the via and forming a desired structure in the via.
摘要:
A device to access and/or verify connections between a chip package and a printed circuit board (“PCB”), specifically within packages lacking back-side measurement access, includes a housing for insertion between the chip package and PCB. A passageway in the housing connects an entrance and an exit from the housing. The entrance is disposed on an end of the housing facing away from the chip package. The exit is disposed on a side of the housing below the chip package such that the passageway is directed at a signal path between the chip package and the PCB. A conductor disposed in the passageway is movable between a retracted position in which a contact end of the conductor is disposed within the passageway of the housing and an extended position in which the contact end of the conductor is disposed outside of the housing and in contact with the signal path.
摘要:
A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer has a plurality of signal pads thereon. The second sub-circuit board includes an edge with an inverse stair-step profile interconnection. A pad-on-pad connector is positioned in-between and electrically interconnects the respective signal layers on each sub-circuit board.
摘要:
Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the slurry comprising a magnetic material, an electrically conducting material, or a combination comprising at least one of the foregoing materials; filling the first hole with a fill material; the fill material being electrically insulating; laminating a first layer and a second layer on opposing faces of the multilayered device to form a laminate; the opposing faces being the faces through which the first hole is drilled; the first layer and the second layer each comprising a second electrically conducting material; drilling a second hole through the laminate; the second hole having a circumference that is encompassed by a circumference of the first hole; and plating the surface of the second hole with a third electrically conducting material.
摘要:
A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.
摘要:
A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.
摘要:
A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via.
摘要:
A method, system and computer program product for implementing an enhanced optical mirror coupling and alignment mechanism utilizing two-photon resist. An initial placement is provided for one or more vias on a printed circuit board. A via is filled with a resist. A series of tightly focused light beams suitably exposes the resist at varying depths in the via, the varying depths defining a sloped polymer in the via after removing resist that had not been at the focus of the light beam. The sloped polymer is coated with reflective material to reflect light into or out of the via.
摘要:
A phase locked loop generates an output corresponding to a source synchronous input and an input link clock signal. A phase locking feedback system receives the input and an input link clock signal and detects phase deviations between the output and the input. The phase locking feedback system also adjusts an adjusted clock signal based on the phase deviations thereby causing the phase locking feedback system to generate the output so that the output has a steady phase relationship with the input. A first mechanism causes the phase locking feedback system not to track phase deviations between the output and the input upon occurrence of a first predefined event, thereby maintaining the adjusted clock signal at a current state.
摘要:
A memory device and memory controller are coupled during driver training to reduce mismatches. The impedances of the system are controlled through a termination at the memory device to yield improvements in timing margins. The coupling of the components on a shared electrical bus through adjustment of the termination values during training removes known offset issues.