发明申请
- 专利标题： Superfine Copper Powder Slurry and Production Method Thereof
- 专利标题（中）： 超细铜粉浆及其制备方法
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申请号： US11722452申请日： 2005-12-16
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公开(公告)号： US20080004358A1公开(公告)日： 2008-01-03
- 发明人: Akira Aoki , Yoshinobu Nakamura , Takahiko Sakaue , Katsuhiko Yoshimaru
- 申请人： Akira Aoki , Yoshinobu Nakamura , Takahiko Sakaue , Katsuhiko Yoshimaru
- 申请人地址： JP Tokyo 1418584
- 专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址： JP Tokyo 1418584
- 优先权： JP2004-371493 20041222
- 国际申请： PCT/JP05/23176 WO 20051216
- 主分类号： B01F3/12
- IPC分类号： B01F3/12 ; C22C9/00
摘要：
It is an object to provide a superfine copper powder slurry which enables finer-pitch wirings formation on the substrates when it is used for an electroconductive ink or an electroconductive paste for wirings. In order to achieve the object, a superfine copper powder slurry produced by suspending a superfine copper powder having powder characteristics of the value DTEM (micron meter) of 0.01 to 0.1, the ratio D50/DTEM of 1.0 to 1.5 and the ratio grain size/DTEM of 0.2 to 1 in a solvent, where (DTEM is) an average primary particle diameter of the powder particle diameter directly measured from observation image of TEM and calculated with observation magnification, and D50 is a particle diameter at 50% cumulative particle size examined by Doppler scattering photo analysis.
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