Invention Application
US20080017891A1 PINNING LAYER FOR LOW RESISTIVITY N-TYPE SOURCE DRAIN OHMIC CONTACTS
有权
密封层用于低电阻N型源漏管OHMIC接触
- Patent Title: PINNING LAYER FOR LOW RESISTIVITY N-TYPE SOURCE DRAIN OHMIC CONTACTS
- Patent Title (中): 密封层用于低电阻N型源漏管OHMIC接触
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Application No.: US11480667Application Date: 2006-06-30
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Publication No.: US20080017891A1Publication Date: 2008-01-24
- Inventor: Suman Datta , Jack T. Kavalieros , Robert S. Chau , Mark L. Doczy
- Applicant: Suman Datta , Jack T. Kavalieros , Robert S. Chau , Mark L. Doczy
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/745

Abstract:
A system or apparatus including an N-type transistor structure including a gate electrode formed on a substrate and source and drain regions formed in the substrate; a contact to the source region; and a pinning layer disposed between the source region and the first contact and defining an interface between the pinning layer and the source region, wherein the pinning layer has donor-type surface states in a conduction band. A method including forming a transistor structure including a gate electrode on a substrate and source and drain regions formed in the substrate; depositing a pinning layer having donor-type surface states on the source and drain regions such that an interface is defined between the pinning layer and the respective one of the source and drain regions; and forming a first contact to the source region and a second contact to the drain region.
Public/Granted literature
- US07355254B2 Pinning layer for low resistivity N-type source drain ohmic contacts Public/Granted day:2008-04-08
Information query
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