发明申请
- 专利标题: Heat dissipating semiconductor package and heat dissipating structure thereof
- 专利标题(中): 散热半导体封装及其散热结构
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申请号: US11801625申请日: 2007-05-10
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公开(公告)号: US20080017977A1公开(公告)日: 2008-01-24
- 发明人: Wen-Tsung Tseng , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
- 申请人: Wen-Tsung Tseng , Chien-Ping Huang , Ho-Yi Tsai , Cheng-Hsu Hsiao
- 申请人地址: TW Taichung
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW Taichung
- 优先权: TW095126659 20060721
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
A heat dissipating semiconductor package and a heat dissipating structure thereof are provided. The heat dissipating structure includes an outer surface, consecutive recessed step portions, and a pressure-releasing groove. The outer surface is exposed from an encapsulant made of a molding compound. The step portions are formed at an edge of the outer surface and have decreasing depths wherein the closer a step portion to a central position of the outer surface, the smaller the depth of this step portion is. The pressure-releasing groove is disposed next to and deeper than the innermost one of the step portions. A molding compound flows to the step portions and absorbs heat from an encapsulation mold quickly, such that a flowing speed of the molding compound is reduced. Pressure suffered by air remaining at the step portions is released through the pressure-releasing groove, thereby preventing flashes of the molding compound and resin bleeding.