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    ELECTRONIC CARRIER BOARD
    1.
    发明申请
    ELECTRONIC CARRIER BOARD 有权
    电子载体板

    公开(公告)号：US20090288866A1

    公开(公告)日：2009-11-26

    申请号：US12535397

    申请日：2009-08-04

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    IPC分类号： H05K1/16 ,  H05K1/02

    CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

    摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应侧面之间的距离大至少约50μm 的相应开口。

    Heat dissipating semiconductor package and fabrication method therefor
    2.
    发明申请
    Heat dissipating semiconductor package and fabrication method therefor 审中-公开
    散热半导体封装及其制造方法

    公开(公告)号：US20080122071A1

    公开(公告)日：2008-05-29

    申请号：US11986362

    申请日：2007-11-21

    申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/373

    CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311

    摘要： A heat dissipating semiconductor package and the fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier, wherein the carrier has an electroconductive layer; allowing a heat dissipating structure having supporting portions to be mounted on and electrically connected to the electroconductive layer of the carrier via the supporting portions thereof while heat dissipating structure being mounted on the chip; after an encapsulation process and removing a part of the encapsulant above the heat dissipating sheet by lapping to expose a surface of the heat dissipating structure from the encapsulant, depositing and forming a metal passivation layer on the surface of the heat dissipating structure by electroplating for preventing the heat dissipating structure from oxidizing.

    摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：在载体的孔中容纳其上安装有芯片的基板，其中载体具有导电层; 允许散热结构，其具有支撑部分，其安装在载体的导电层上并通过其支撑部分电连接，同时散热结构安装在芯片上; 在封装工艺之后并且通过研磨去除散热片上方的一部分密封剂，以从密封剂暴露出散热结构的表面，在散热结构的表面上沉积和形成金属钝化层，通过电镀防止 散热结构从氧化。

    Electronic carrier board applicable to surface mount technology
    5.
    发明授权
    Electronic carrier board applicable to surface mount technology 有权
    电子载板适用于表面贴装技术

    公开(公告)号：US07889511B2

    公开(公告)日：2011-02-15

    申请号：US12535397

    申请日：2009-08-04

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    IPC分类号： H05K7/10

    CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

    摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁和对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应的侧面之间的距离大至少约50μm 的相应开口。

    Electronic carrier board applicable to surface mounted technology (SMT)
    6.
    发明授权
    Electronic carrier board applicable to surface mounted technology (SMT) 有权
    电子载板适用于表面贴装技术（SMT）

    公开(公告)号：US07573722B2

    公开(公告)日：2009-08-11

    申请号：US11654273

    申请日：2007-01-16

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    IPC分类号： H05K7/10

    CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a fourth sidewall of each of the two bond pads. The first sidewall and the fourth sidewall are both perpendicular to an alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the fourth sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

    摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同的方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第四侧壁。 第一侧壁和第四侧壁都垂直于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第四侧壁与相应的侧面之间的距离大至少约50微米 的相应开口。

    Electronic carrier board
    7.
    发明申请
    Electronic carrier board 有权
    电子载板

    公开(公告)号：US20070164084A1

    公开(公告)日：2007-07-19

    申请号：US11654273

    申请日：2007-01-16

    申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

    IPC分类号： A47J36/02

    CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

    摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁和对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应侧面之间的距离大至少约50μm 的相应开口。

    METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE
    8.
    发明申请
    METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开
    制造散热半导体封装结构的方法

    公开(公告)号：US20110287588A1

    公开(公告)日：2011-11-24

    申请号：US13195639

    申请日：2011-08-01

    申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L21/56

    CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

    摘要翻译： 公开了一种散热半导体封装结构及其制造方法。 该方法包括：在至少半导体芯片和封装单元上布置并电连接到芯片载体; 在所述封装单元的顶表面上设置有经由所述平坦部分具有平坦部分和支撑部分的散热元件; 在由散热元件的平坦部分和支撑部分形成的接收空间中接收封装单元和半导体芯片; 以及在芯片载体密封剂上形成以封装封装单元，半导体芯片和散热元件。 散热元件消散封装单元产生的热量，提供EMI屏蔽，防止封装单元与密封剂之间的分层，降低热阻，防止开裂。

    Method for fabricating semiconductor device and carrier applied therein
    9.
    发明申请
    Method for fabricating semiconductor device and carrier applied therein 审中-公开
    制造应用于其中的半导体器件和载体的方法

    公开(公告)号：US20080213942A1

    公开(公告)日：2008-09-04

    申请号：US12074321

    申请日：2008-03-03

    申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

    发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/12 ,  H05K7/00

    CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

    摘要： This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions. The inspection aperture is inspected with a naked eye to determine whether the gap is completely filled with the adhesive, thereby reducing inspection costs and increasing yields of products with no additional packaging costs.

    摘要翻译： 本发明提供一种用于制造应用于其中的半导体器件和载体的方法。 该方法包括以下步骤：将芯片安装的基板设置在载体的开口中; 在所述载体中至少形成存储孔径和至少一个检查孔; 将粘合剂注入到存储孔中，以通过毛细管力用粘合剂填充基底和载体之间的间隙; 确定检查孔是否填充有粘合剂以确定间隙是否完全被粘合剂填充; 响应于积极的结果，进行成型处理以形成用于封装芯片的模塑料; 并且执行焊球的注入和单一化处理以形成具有所需尺寸的半导体器件。 检查孔径用肉眼检查以确定间隙是否完全充满粘合剂，从而降低检查成本并提高产品的产量，而不需要额外的包装成本。

    Heat dissipating semiconductor package and heat dissipating structure thereof
    10.
    发明申请
    Heat dissipating semiconductor package and heat dissipating structure thereof 审中-公开
    散热半导体封装及其散热结构

    公开(公告)号：US20080017977A1

    公开(公告)日：2008-01-24

    申请号：US11801625

    申请日：2007-05-10

    申请人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    发明人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A heat dissipating semiconductor package and a heat dissipating structure thereof are provided. The heat dissipating structure includes an outer surface, consecutive recessed step portions, and a pressure-releasing groove. The outer surface is exposed from an encapsulant made of a molding compound. The step portions are formed at an edge of the outer surface and have decreasing depths wherein the closer a step portion to a central position of the outer surface, the smaller the depth of this step portion is. The pressure-releasing groove is disposed next to and deeper than the innermost one of the step portions. A molding compound flows to the step portions and absorbs heat from an encapsulation mold quickly, such that a flowing speed of the molding compound is reduced. Pressure suffered by air remaining at the step portions is released through the pressure-releasing groove, thereby preventing flashes of the molding compound and resin bleeding.

    摘要翻译： 提供散热半导体封装及其散热结构。 散热结构包括外表面，连续凹进的台阶部分和压力释放槽。 外表面从由模塑料制成的密封剂暴露。 台阶部分形成在外表面的边缘处并且具有减小的深度，其中台阶部分越接近外表面的中心位置，该阶梯部分的深度越小。 压力释放槽设置在步骤部分的最内侧之上并深度。 模塑料流到台阶部分并迅速从封装模具吸收热量，从而降低模塑料的流动速度。 通过压力释放槽释放在台阶部分残留的空气所产生的压力，从而防止模塑料的闪烁和树脂渗色。