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发明申请
US20080023812A1 Semiconductor package having passive component and semiconductor memory module including the same 有权
具有无源元件的半导体封装和包括该元件的半导体存储器模块

Semiconductor package having passive component and semiconductor memory module including the same
摘要：
Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.
摘要（中）：

示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。

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