Invention Application
- Patent Title: Manufacturing method of light-emitting element
- Patent Title (中): 发光元件的制造方法
-
Application No.: US11826085Application Date: 2007-07-12
-
Publication No.: US20080026497A1Publication Date: 2008-01-31
- Inventor: Akira Furuya
- Applicant: Akira Furuya
- Applicant Address: JP Yamanashi
- Assignee: EUDYNA DEVICES INC.
- Current Assignee: EUDYNA DEVICES INC.
- Current Assignee Address: JP Yamanashi
- Priority: JP2006-193512 20060714
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A manufacturing method of a light-emitting element includes emitting a laser light to a division region for separating a light-emitting element formed on a substrate, physically dividing the substrate along the division region, and removing a surface layer on at least one of the side faces of the substrate that is exposed by the dividing of the substrate.
Public/Granted literature
- US07745240B2 Manufacturing method of light-emitting element with surface layer removal Public/Granted day:2010-06-29
Information query
IPC分类:
