发明申请
- 专利标题: Automatic wafer edge inspection and review system
- 专利标题(中): 自动晶圆边缘检查和审查系统
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申请号: US11891657申请日: 2007-08-09
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公开(公告)号: US20080030731A1公开(公告)日: 2008-02-07
- 发明人: Ju Jin , Satish Sadam , Vishal Verma , Zhiyan Huang , Siming Lin , Michael Robbins , Paul Forderhase
- 申请人: Ju Jin , Satish Sadam , Vishal Verma , Zhiyan Huang , Siming Lin , Michael Robbins , Paul Forderhase
- 申请人地址: US MI Bloomfield Hills 48302
- 专利权人: Accretech USA, Inc.
- 当前专利权人: Accretech USA, Inc.
- 当前专利权人地址: US MI Bloomfield Hills 48302
- 主分类号: G01J4/00
- IPC分类号: G01J4/00 ; G01N21/25 ; G01N21/47
摘要:
A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. The optic can be rotated radially relative to a center point of the substrate edge to allow for focused inspection of all surfaces of the substrate edge.
公开/授权文献
- US07508504B2 Automatic wafer edge inspection and review system 公开/授权日:2009-03-24
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